The Hong Kong Applied Science and Technology Research Institute (ASTRI) was invited to participate in the Next Generation Network Seminar 2016 which was organised by the Future Network Department of Beijing Institute of Collaborative Innovation (BICI) on 22 December 2016 in Beijing, China. On the same occasion, ASTRI signed a collaborative Memorandum of Understanding (MoU) on research and development (R&D) of next generation network technologies.
In the seminar, Dr Justin Chuang, Vice President, Next Generation Network of ASTRI shared the latest development of mobile communications with the participants. Industry leaders, experts, senior executives from renowned high-technology companies and scholars from universities in China were gathered together to discuss and exchange views on the development trends and prospects of next generation network and related technologies.
In addition, Dr Justin Chuang represented ASTRI to sign the MoU with BICI which further strengthens its collaboration to jointly carry out research and development (R&D) projects of next generation network technologies including the future network top layer design and overall architecture, core mechanism and key technologies of core network, wired access network, radio access network, terminals, and upper layer applications etc.
In 2015, ASTRI signed a MoU with BICI to establish FinTech Collaborative Innovation Centre focusing R&D on financial technology, big data and mobile software platform. With the signing of MoU on next generation network technologies with BICI, the strategic partnership between ASTRI and BICI will facilitate the development of innovation and technology in Hong Kong and Mainland China.
Dr Justin Chuang (left), Vice President, Next Generation Network of ASTRI, signs the MoU with Mr Li Chunan (right), Vice Executive Director of BICI on joint R&D of next generation network technologies
Next Generation Network Seminar 2016 (Photo source: BICI website)
Related News
ASTRI congratulates China Chippacking Technology for successfully listed on Shanghai Stock Exchange
[Hong Kong, 24 June 2021] The Hong Kong Applied Science and Technology Research Institute (ASTRI) expresses its warmest congratulations to its partner, China Chippacking Technology Co., Ltd, which was successfully listed on the Science and Technology Innovation Board of the Shanghai Stock Exchange today and will trade under the ticker symbol 688216.SH ...
See More
ASTRI welcomes and supports “Early Vaccination for All” and encourages employees to get a COVID-19 Vaccination in Hong Kong
[Hong Kong, 31 May 2021] The Hong Kong Applied Science and Technology Research Institute (ASTRI) has welcomed and expressed its full support for new government initiatives under “Early Vaccination for All” and again encouraged its employees to take advantage of the COVID-19 vaccination programme ...
See More
ASTRI develops Next Generation Food Safety Management Platform for smart import of frozen meat to enhance monitoring and traceability
[Hong Kong, 27 May 2021] The Hong Kong Applied Science and Technology Research Institute (ASTRI) has adopted blockchain and Internet of Things (IoT) technologies to create the “Next Generation Cold Food Import Safety Management Platform” to digitise and enhance the monitoring and control of the import of frozen or chilled meat from Mainland China ...
See More
ASTRI launches one of the world’s largest C-V2X public road tests, promoting Smart Mobility to improve the city’s mobility competence while enhancing road safety and efficiency
(30 March 2021) The Hong Kong Applied Science and Technology Research Institute (ASTRI) successfully launched one of the world’s largest cellular vehicle-to-everything (C-V2X) public road tests in Hong Kong today, to study and test the technology’s application scenarios on the roads of Hong Kong, as well as the network and infrastructure required for the application ...
See More
ASTRI’s innovations win 23 accolades at Geneva Inventions
[Hong Kong, 24 March 2021] The Hong Kong Applied Science and Technology Research Institute has won a record 23 awards, comprising seven golds and 16 silvers, at the prestigious International Exhibition of Inventions Geneva, a 100% success rate for inventions submitted ...
See More
