Panel Level LED Packaging Platform Development (PL-LED)
20111219 - 20130618
Dr Enboa Wu
By the end of the project, the following items will be delivered for the licensees for mass production. Detailed specifications for the functional prototypes will be described later in the report. 1. Functional prototypes of: a. Multiple LED array for demonstration of the PL-LED platform; b. 10 ~ 35W Single LED white light module @16V&0.8A (specifications are tabulated in Annex A) for projector applications; c. 5W ~ 15W LED light module for general lighting application. Light module using PL-LED package (specifications are given in Table 3 of Section C) and commercial available LED packages will be integrated into LED MR16 spotlight, PAR lamp, or E27 light bulb for performance evaluation. Target specifications of different lamps are given in Table 4 of Section C. 2. Documents (soft & hard copies) for design and process guidelines: a. Design rule of the PL-LED structure (electrical, optical, thermal, and material); b. Evaluations of the PL-LED thermal design; c. Flowchart and run card of the process integration; d. Reliability characterization procedures and preliminary measurement results. 3. Report on the technology status and development strategy for ultra high power and high power-density LED chip/component/module, including IP mapping and benchmark analysis.
Advanced Furnace Systems Corp. Epistar Corp. Ledman Optoelectronic Co., Ltd Shenzhen Sei Farer Photonics Technology Co., Ltd The Hong Kong Polytechnic University
As fundamental and applied LED technologies continue to evolve, substantial enhancement on LED efficacy and reduction in cost are realized. These advancements have driven LED to steadily progress from conventional low power applications toward more demanding fields of application such as display, portable electronics and general lighting. While LED is relatively new in the aforementioned industries, the LED technology players have begun to establish and introduce LED/electronic integration packaging technologies, and to promote ultra high power and high power-density LED package design as well as fabrication. Owing to the advancing LED packaging technologies, innovative LED products could be piloted to satisfy upcoming market demands for high brightness, high reliability and cost competitiveness. To resolve the critical concerns in realizing ultra high power and high power-density LED packages, the project team proposes to develop the Panel Level LED Packaging Platform (PL-LED). It will consist of frameworks already established in electronic packaging and mature substrate processes to achieve ASTRI’s novel design of patentable LED package structures. Two test vehicles, light sources for general lighting and projector applications, are selected for demonstration and verification of the platform technologies. In comparison with existing LED products, at least 25% reduction in thermal resistance and improvement in package reliability could be achieved with the proposed LED package structure. In addition, redistribution layer (RDL) technology will be introduced to build a LED device with large emission area. This approach will contribute to an overall 10% increase in light output. Furthermore, the introduction of panel format in the PCB substrate reduces material cost and increases throughput, achieving an overall 30% in cost reduction. Upon successful development of the PL-LED platform, the team envisions the delivery of upgraded capabilities and bringing in greater profit opportunities to the LED packaging and lighting industry in Hong Kong and PRD region.