HONGKONG TONGFU TECHNOLOGY CO., LIMITED
GIANT TECHNOLOGIES COMPANY LIMITED
The global satellite transmission is expected to generate market value of over 150 billion USD by 2030, and the development of non-terrestrial networks (NTNs) will benefit billions of people worldwide who currently still lack access to the internet. The radio frequency (RF) transceiver chip in NTN plays a crucial role in satellite communication, offering high-speed, low-power, and cost-effective connectivity by operation with the baseband chip. This project will develop a fully integrated RF transceiver chip supporting NTN terminals for 5G-A/6G applications, which is also compatible with the latest 3GPP standards. A system-level RF-baseband co-simulation platform will be established for the parameter optimization of the RF transceiver chip and the innovative circuit-level architecture design will be developed to ensure high-performance operation at frequencies up to 30 GHz. In addition, the state-of-the-art 22/28 nm fully-depleted silicon-on-insulator (FD-SOI) technology will be adopted to fabricate the RF transceiver chip due to the low parasitic capacitance, low mask cost, reduced power consumption, etc. This full project will significantly expedite the advancement of NTN RF transceiver chip development in the market, while enabling Hong Kong to pioneer the NTN RF chip design in the world by being deeply involved in technology standardization and starting the development in the early stage.
