New Electrodeposition Materials for 3D-Interconnect of High Density Substrate

New Electrodeposition Materials for 3D-Interconnect of High Density Substrate

  • New Electrodeposition Materials for 3D-Interconnect of High Density Substrate
    ARD/119
    20130301 - 20130831
    1950

    Dr Xunqing Daniel Shi
    Dr Enboa Wu Dr Bin XIE Dr Yaofeng SUN Dr Min GAO Mr Yat Kit TSUI Dr Dan YANG Mr Shu Kin YAU Mr Minghui Gao