Electroplated Sn-Bi Micro-bump for Low Temperature Bonding (ESM) (ART/367CP)

Electroplated Sn-Bi Micro-bump for Low Temperature Bonding (ESM) (ART/367CP)

Electroplated Sn-Bi Micro-bump for Low Temperature Bonding (ESM) (ART/367CP)
ART/367CP
Platform
01 / 08 / 2023 - 31 / 10 / 2024
9165.5

Dr Minjie XU

L Lab Corporation (Hong Kong) Limited
Huawei Technologies Co., Ltd.