OVP7200 and OVP921 enable compact design and deliver 720P HD video to ASTRI’s new heads-up display
[Hong Kong/LAS VEGAS, January 7, 2015] OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced from the Consumer Electronics Show in Las Vegas, that its high definition (HD) OVP7200 and OVP921 liquid-crystal on silicon (LCOS) chipset will be used in an advanced heads-up display (HUD) developed by the Hong Kong Applied Science and Technology Research Institute (ASTRI). The new HUD is specifically designed for use in next-generation automobiles.
“Heads-up displays are already popular among premier automobile manufacturers. As the technology becomes more accessible, we expect to begin to see these displays being deployed in mainstream automotive designs,” said Mr. Kenny Chan, Senior Manager at ASTRI. “OmniVision’s complete LCOS chipset gives us a competitive advantage in this growing market segment by enabling us to deliver a cost-effective and high-performance heads-up display solution that meets the high standards of automobile manufacturers.”
OmniVision’s OVP7200 is a single panel, color field sequential LCOS device with native HD resolution of 1280 x 720 and a diagonal measurement of 0.37 inches. The cost-effective, low-power consumption OVP7200 uses an all-digital technology to drive the liquid crystal to deliver a stable and reproducible image.
Working in tandem with the OVP7200, the OVP921 is a companion chip that provides advanced image processing and a host of other features that simplify system design, save space, and reduce power consumption. The OVP921 provides optimized system performance without the need for an external image processor or memory component.
Related News
ASTRI delegation visits important scientific research institutions in Beijing
Mr Hugh Chow – Chief Executive Officer of ASTRI, Dr Daniel Shi – Senior Director, and Dr Xie Bin – Principal Engineer, recently visited several important scientific research institutions in Beijing, including the Institute of Microelectronics of the Chinese Academy of Sciences, the Beijing Collaborative Innovation Institute and the Strategic Industry Alliance for Third Generation Semiconductor Technology Innovation ...
See More
ASTRI supported the China International Opto-electronic Expo (CIOE)- one of the largest industry shows for Opto-electronics
The China International Opto-electronic Expo (CIOE), one of the largest industry events in the sector, took place at the Shenzhen Convention and Exhibition Centre from 4-7 September 2019 ...
See More
10th Management Committee meeting of the Hong Kong Branch for Application Specific Integrated Circuits of the Chinese National Engineering Research Centre held
The 10th Management Committee meeting of the Hong Kong Branch of the Chinese National Engineering Research Centre (CNERC) focusing on Application Specific Integrated Circuit Systems (ASICS) took place in Nanjing on 22 July 2019 ...
See More
ASTRI’s innovation showcase offers fun and excitement for families over the long weekend
ASTRI took part in the Greater Bay Area Festival in Victoria Park, Causeway Bay from 29 June to 1 July 2019 ...
See More
ASTRI drives forward 5G + C-V2X + AI innovation and transformation with Intel technology
[27 June 2019, Hong Kong] At the Mobile World Congress (MWC) Shanghai 2019, Hong Kong Applied Science and Technology Research Institute(ASTRI) revealed their collaborations with Intel on 5G Standalone (SA) Core Network and Roadside Edge AI (Artificial Intelligence) for C-V2X (Cellular Vehicle-to-Everything) that power the new era of network transformation with the compelling capabilities of 5G, C-V2X and AI working together ...
See More
