Wafer Level LED System-in-Package Platform Development

Wafer Level LED System-in-Package Platform Development

  • Wafer Level LED System-in-Package Platform Development
    ART/075CP
    20091123 - 20110522
    10400

    Dr Enboa Wu
    At the end of this project, functional prototypes and following reports will be delivered which will be made for licensing to our customers for mass production. Detailed deliverables are shown as below: 1. Functional prototype: a) 3W and 5W LED flash module for camera phone application; b) 3W and 5W functional light engine for general lighting application. 2. Worldwide market report comprises worldwide survey/benchmark/report of up-to-date LED camera flash module and functional light engine in LED lighting market. 3. Technology status and development strategy including IP mapping and development strategy. 4. Design documents and the following information: • Document of electrical design and evaluation result (Soft & Hard Copy) • Document of optical design and evaluation results (Soft & Hard Copy) • Document of thermal and structure design (Soft & Hard Copy) • Flowchart and run card of process integration (Soft & Hard Copy) • Recommended supplier list • Molds and related jigs used in this project 5. Preliminary specifications of delivered prototypes will be clearly listed in tables and shown in appendix.
    GZ Lovely Lighting [Sponsor]

    In recent years, fundamental and applied technologies of LEDs were significantly improved. These achievements enhanced LEDs’ efficacy and dramatically reduced the cost of LEDs. Originally, LEDs were widely used in conventional applications, such as traffic light, indicators, and etc. Due to the cost reduction and performance improvement, LEDs are aggressively entering display backlight, mobile electronics, and general lighting applications. Because of the characteristics and advantages of LEDs, LEDs also cause great impact to these new fields. However, new products in these new applications are requested to have more functions, smaller size, and less power consumption. For satisfying with these end-product design criteria, LED components need to follow the market trend (miniaturized size, modularized system, and lower cost). Unfortunately, the current discrete LED component solution could not comply with these criteria. In this project project, the team proposed to develop the Wafer-Level LED System-in-Packaging (WL-LED-SiP) design and process platform. The team plans to adopt mobile flash module and light engine for general lighting application as project deliverable and test vehicle for platform evaluation. By promoting the platform and two applications that will be developed in this project, the team wish could assist and support manufacturers where located in Hong Kong and Pearl River Delta to upgrade their technologies and get more profit from the market.