For ITF project: 1. Establishment of design & simulation platform on next generation power delivery solution for smart city applications and the design report, comprising: a) Electrical design of the power delivery system, including modified totem-pole topology, customized driver circuit for GaN switching devices, automatic current balancing circuit, etc.; b) Structure design of the power delivery system, including modeling and simulations on the power razor architecture, stress, strain, creep, vibration and mechanical shock, etc.; c) Thermal design of the power delivery system, including finite element & computational fluid dynamic modeling and simulations on static state & transient thermal performance; d) Magnetic design of the power delivery system, including development & evaluation of the 3D integrated magnetic component, etc.; e) Firmware design of the power delivery system, including modified totem-pole topology control scheme and customized driving scheme for GaN switching devices, etc. 2. Process design & optimization, sample build and the assembly report, comprising: a) Process design and optimization; b) Prototype sample build. 3. Performance evaluation methodologies & testing results and the final report, comprising: a) Thermal evaluation methodology and test results; b) Electrical evaluation methodology and test results; c) Long-term reliability assessment methodology and the analysis report; d) System-level evaluation & field test at customer side; e) Final report. 4. For contract service project with Fenghua: An evaluation report of high heat dissipation and high density system-in-package materials; A design report of high heat dissipation, fully molded and high density power module & 50 pcs prototype samples; A process and reliability simulation report of high heat dissipation and high density system-in-package; and A testing report of high heat dissipation, fully molded and high density power module. 5. For contract service project with Smart Power & Energy Semi. Co. Ltd.: A design report of high density power conversion system for smart city applications; A process design report of high density power conversion system for smart city applications & 2000 pcs prototype samples; An evaluation report of high density power conversion system for smart city applications & 2000 pcs prototype samples.
Fenghua Research Institute (Guang Zhou) Co., Ltd.
Fenghua Research Institute (Guang Zhou) Co., Ltd. (CS) [Sponsor]
Smart Power & Energy Semi Co. Ltd.
Smart Power & Energy Semi Co. Ltd. (CS) [Sponsor]
Building Hong Kong into a world class smart city is one of the government’s focuses in the next several years, while data centers are the most important fundamental infrastructures. Besides, Hong Kong is the best place in China to serve as the data hub bridging the mainland to the whole world, which is similar to the key role it used to play in the 1980s. There’re already more than 50 data centers in Hong Kong. It has an overall power consumption of close to 300MW, and it is further projected to approach 10% of the total electricity usage by 2020. Therefore, improving power density and conversion efficiency of the power delivery system in data centers are two factors driving the technology innovation and evolution in the industry.
By developing a series of generic platform technologies of the component, module and sub-system levels, this project aims to develop an ultra-high density and efficiency AC-DC power delivery solution by proposing the following key platform technologies to solve the coupled electrical-thermal challenges for the next generation smart city applications: (1) By leveraging the merits of GaN switching devices, such as low Rds-on, high speed operation and zero reverse recovery loss, etc., a Bridgeless Totem-Pole topology will be adopted with a novel control algorithm (TP-GaN) to breakthrough the efficiency limit of the Silicon devices and reduce the loss of the power stage up to 50%; (2) A brand-new Modularized Power Razor Architecture (M-PRA) and the implementation of 3D Magnetic Integration (3D-MI) technology developed in the previous seed project to double the system-level power density; (3) Flatness and conduction-driven product architecture to improve the thermal performance by 30%.
Besides data centers, it is believed that the proposed platform technologies in this project are also suitable for other smart city applications where AC to DC power delivery is desired, such as telecommunications, home appliances, consumer electronics, etc. It is projected to be a 30+ billion market by 2021 according to the market research data released by the IHS in 2017, and our final target is to provide not only a technology platform but also a tangible high efficiency & density power delivery solution beneficial to all the smart city related applications in Hong Kong, China and world-wide.