Hardware enabled Privacy and Security Technology for smart home (HPST) (ART/311CP)

Hardware enabled Privacy and Security Technology for smart home (HPST) (ART/311CP)

Hardware enabled Privacy and Security Technology for smart home (HPST) (ART/311CP)
ART/311CP
Platform
01 / 07 / 2020 - 31 / 12 / 2021
13,133

Mr Tim Ka Lung WONG

Marvel Digital AI Limited (Sponsor)
FORTSENSE TECHNOLOGY(HK)CO.,LIMITED (Sponsor)
Bull Capital Partners (Hong Kong) Limited (Sponsor)
FORTSENSE TECHNOLOGY(HK)CO.,LIMITED (CS) (Sponsor)
Marvel Digital AI Limited (CS) (Sponsor)


As the “entrance” of smart home, smart locks have huge market potential with a forecasted global shipment of 51 million units in 2020. Among the biometric identification methods, 3D face model technology is being adopted rapidly because it is easy-to-use, high-accuracy, non-intrusive, and has higher social acceptability. However, it faces many challenges in security, privacy protection, battery life, and cost. Existing IC chipset enabled solutions cannot solve these problems well. This project aims to develop a hardware-enabled solution for privacy protection and security enhancement for smart locks and smart home-related applications. The project team leverages the state-of-the-art research outcomes and mature IC design technology as well as ASTRI’s original AI accelerator in the development. Innovations include (1) 3D dynamic anti-spoofing for security, (2) IC-level privacy protection, (3) power management and fast wake-up time to extend battery life, and (4) high-efficiency core engine to reduce cost. We will implement all the innovations in a 3D face model accelerator verified by the FPGA platform and develop a smart lock reference design to facilitate mass production. This project provides a practical solution for smart lock manufacturers worldwide. The solution is applicable in both Hong Kong and mainland China, where both government and industry have intensively promoted the smart home/city. It also helps to cultivate high-tech innovations in both smart home/city and semiconductor areas in Hong Kong and GBA.