Grafted Polymer Insulator for Through-Silicon-Via (GPI-TSV) Applications
ARD/169
20160331 - 20161230
2800
Dr Yaofeng SUN
Dr Wenwei ZHENG
Dr Daniel SHI
Ms Sidar LAI
Dr B XIE
Dr CW CHAN
Dr KW HAU
Dr MJ XU
Mr SK YAU
Dr S XU
Dr HL WU
Mr PK CHEUNG
Mr SY LAO
Mr HF FU
Mr Jason JI
Mr WK LUK
Ms KW KO