Grafted Polymer Insulator for Through-Silicon-Via (GPI-TSV) Applications

Grafted Polymer Insulator for Through-Silicon-Via (GPI-TSV) Applications

  • Grafted Polymer Insulator for Through-Silicon-Via (GPI-TSV) Applications
    ARD/169
    20160331 - 20161230
    2800

    Dr Yaofeng SUN
    Dr Wenwei ZHENG Dr Daniel SHI Ms Sidar LAI Dr B XIE Dr CW CHAN Dr KW HAU Dr MJ XU Mr SK YAU Dr S XU Dr HL WU Mr PK CHEUNG Mr SY LAO Mr HF FU Mr Jason JI Mr WK LUK Ms KW KO