AMS IP Platform for MEMS Sensor

AMS IP Platform for MEMS Sensor

  • AMS IP Platform for MEMS Sensor
    ART/116CP
    20110601 - 20131130
    13298

    Mr David Kwong
    Project deliverables are summarised in the following * IP families comprising the following technologies : 1) On-chip thermal and power management IPs including LDO, voltage Regulator, Precision temperature sensor; 2) Low power data converters including 12-bit ADC, 12-bit DAC; 3) Low noise-micro-power signal processing analog front end IPs including Capacitance Transimpeduance Amplifier (CTIA), Programmable Gain Amplifier ( VGA ); 4) On-chip timing generation and IOs including oscillator, PLL modules and off-chip interface; 5) MEMS specific SoC ESD protection cells. * 0.35um and 0.18um CMOS IPs and evaluation reports. * An integrated 0.35um CMOS ROIC (read out IC) for MEMS microbolometer. 6) An integrated 0.18um CMOS g-sensor IC for multi-axis MEMS micro-accelerometer
    Alchip Technologies Inc [Sponsor]

    The ability of merging mechanical and electrical functions in the same substrate whose sizes range from micrometer to millimeter has created a new class of solid state device called MEMS (microelectromechanical system). MEMS achieves certain functions by electromechanical or electrochemical means. It generally consists of two basic components: a sensing and /or an actuating element and a signal transduction unit. However in almost all MEMS applications high performance analog and mixed signal integrated circuits are needed to convert the sensor signals for further processing and control. Currently these high performance application specific analog IPs are not available to our industry in an affordable manner. Therefore the objectives of this project are : 1) Develop a comprehensive analog IP library consisting all of the key technologies for several integrated MEMS sensor applications. These will include power management and on chip temperature sensing, low noise analog signal processing and conditioning, and low power data conversion, 2) Establish MEMS SOC specific mixed signal integration and design verification capability as a design service to industry 3) Perform product reliability and qualification for ready commercialization of ASTRI's IPs. The project team will leverage their proven expertise in areas of power management, signal processing and data conversion and optimalize a family of reusable IPs for integrated MEMS sensor applications. The availability of such technology will enable our industry to develop integrated circuit products for this growing market.