Adapting High-Speed I/O System for EDA Cloud Computing Platform (ART/335CP)

Adapting High-Speed I/O System for EDA Cloud Computing Platform (ART/335CP)

Adapting High-Speed I/O System for EDA Cloud Computing Platform (ART/335CP)
ART/335CP
Platform
08 / 12 / 2021 - 07 / 08 / 2023
9,740.270

Dr Beiping YAN

SMIT Systemic (HK) Limited (Contract Service)
L Lab Corporation (Hong Kong) Limited (sponsorship)


EDA (Electronic Design Automation) has penetrated every aspect of the IC industry. It is thought of as a fulcrum of digital economy, because it has pried up semiconductor industry by more than 400 billion dollar and the entire electronic system industry behind trillions of dollars. No EDA, no today’s IC industry. EDA cloud computing chip design is a trend for IC industry. Cloud computing chip design enables industry-wide collaboration among design verification, tape-out and manufacture. This project is going to develop adapting high-speed I/O system (or adaptor) to support EDA cloud computing platform. As a key component, the I/O system can ensure high-speed data transmission between emulator and cloud end. EDA cloud computing chip design is an emerging technology. Adoption of this technology will have a significant impact on IC industry. It not only can build a semiconductor industry chain collaborative service platform by joining upstream and downstream partners, but also can help IC enterprises to reduce cost and time to market, greatly enhancing their competitiveness.