ASIC And Advanced Electronics | ASTRI - Hong Kong Applied Science And Technology Research Institute Company Limited

As the Hong Kong Branch of the National Engineering Research Center for Application Specific Integrated Circuit System (CNERC), ASTRI drives innovation in microelectronics and integrated circuits, developing cutting-edge ASIC solutions and advanced electronics that serve diverse industry sectors. Our expertise spans intelligent manufacturing, automotive technologies, artificial intelligence and next-generation electronics packaging. ASTRI’s ASIC and Advanced Electronics portfolio includes AI-enhanced Electronic Design Automation (EDA) tools, Ultrasonic Sensor SoC chips for automotive reversing radar systems, and high-performance Neural Processing Unit (NPU) AI chips for edge computing applications.

Our advanced electronics capabilities encompass Through-Silicon Via (TSV) electroplating technology, high-power electronics packaging materials including sintered nano-metal die attach adhesives with exceptional thermal conductivity, high-Tg Electromagnetic Compatibility (EMC) materials, comprehensive thermal management solutions such as immersion coolants and thermal interface materials, and specialised nCoating materials for flexible electronics. These innovations position Hong Kong as a hub for semiconductor design and advanced electronics manufacturing, supporting the region’s technological advancement and industrial competitiveness.

Research Areas & Focus

3D Integrated Chip

Power Control and Driver Chip
16 / 14 / 12nm General Purpose and Special Purpose IO Cell Libraries

The 3rd Generation Semiconductors

Ultrasonic Sensor SoC Chip for Automotive Reversing Radar
TSV Electroplating
SiC / GaN based Power and Energy Storage Technology
SiC / GaN based Power Modules

AI and IoT Chips

NPU AI Chips
Electronic Design Automation (EDA) and AI
Vision System AI Algorithms and Chips
Low-power Wireless Connection Chip

Electronics Packaging

High Power Electronics Packaging Materials
High Performance Electronics Packaging Materials
Thermal Management Materials
nCoating Materials for Flexible Devices and Electronics

More about ASTRI

Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key force and super connector driving innovation and technology advancement in Hong Kong, the Greater Bay Area, and the global innovation ecosystem. This role is strengthened through its merger with Nano and Advanced Materials Institute (NAMI).

Committed to bringing high impact research from lab to market, ASTRI advances interdisciplinary, market driven R&D that delivers practical innovations for industry and meaningful benefits for society.

Its technological strengths and capabilities enable AI powered, cross disciplinary ICT and advanced materials solutions across Smart City, Financial Technologies, Digital Health and Life Sciences, New Industrialisation and Intelligent Manufacturing, Application-Specific Integrated Circuits (ASIC) and Advanced Electronics, New Energy and Energy Storage, and Green and ESG Technologies.

Over the years, ASTRI has cultivated a strong pool of I&T talent and earned numerous international awards for its pioneering innovations and contributions to industry and the community. Following the merger with NAMI, ASTRI’s cumulative global patent portfolio has grown to over 1,500, with more than 2,200 technologies successfully transferred to industry.

With enhanced scale and capabilities, ASTRI is uniquely positioned to elevate Hong Kong’s innovation capacity, accelerate technology commercialisation, and drive societal and economic progress through world class applied research.