Smart Optical Sensors
ART/007CP
20061201 - 20080531
10860
Dr Enboa Wu
• Technology Platform
Develop intellectual proprieties for the optical sensor developments in the following areas:
- Micro optoelectronics packaging: integrate optical parts, opto-electronic chips, ICs and passive components in plastic molding and leadframe based package to provide high integration, compact and low cost solution
- Signal modulation and coding: ensure the sensors to have good linearity, sensitivity, ambient light immunity and object reflectivity robustness.
• Prototypes
- 2-in-1 proximity sensor and infrared (IR) remote control receiver module
- Distance sensor with compact size, low cost and resolution of 10um in working range from 5 to 10 mm.
- Tilt sensor which can provide non-contact sensing mechanism, 1kHz fast response, 0.01 deg resolution and +/- 2deg sensing range
- Fiber-optic data transmission cable with multiple optical data lane and integrated standard electrical interface for sensor data transmission. Date rate per channel is up to 3.4 Gb/s and transmission distance is greater than 10 meter.
• Documentations
- Marketing survey report including market status, forecast, benchmark of existing competitive technologies
- IP mapping report targeted on high market potential sensor concepts, applications, and products.
- Engineering documents for sensor technology transfer
ASM Assembly Automation Limited [Sponsor]
Automated Precision Ltd
SAE Magnetics (H.K.) Ltd.
TIME Interconnect Limited [Sponsor]
This R&D project will develop a technology platform for optical sensors which can provide unique features such as compact size, fast response, cost effectiveness and enhanced functionalities. The technological challenges such as limited space for sensor implementation, high resolution readout, cost reduction and more functions have initiated technology development in two areas: micro optoelectronics packaging and signal modulation schemes. Based on these technologies, we will develop optical proximity sensor for smart home control and smart cell phones, distance sensor and tilt sensor for semiconductor manufacturing according to the requirements from industrial partners. Besides, we will also develop data cable with embedded optical link to provide a robust, EMI immune channel for sensing signal transmission. In order to achieve these targets, we will leverage ASTRI's photonic component domain knowledge in fiber optic transceiver development. This project can deliver high quality technology to Hong Kong industry and improve our local industrial partners’ competitiveness in the world market.