1. a) Establishment of a technology platform of design and processes for 1200V SiC devices including structural simulation, photolithography, metallization, dry thermal oxidation, physical and chemical vapor deposition of field oxide and nitride, bonding materials formation, ion implantation and annealing, etc; b) Development of bi-directional switch modules using silicon devices. [Completion date: 9 months after the project start] 2. a) Development of 1200V SiC devices and flip-chip packaging (without bonding wires) b) Development of matrix converter modules using (i) Si devices and; (ii) SiC devices and related packaging (by about 20% power loss reduction using SiC bidirectional switches). The target matrix converter modules is 122mm x 62mm. [Completion date: 18 months after the project start] 3. a) Final matrix converter modules with 3-phase 380V typical input, SiC device whose typical blocking voltage > 1200V & current > 55A, and power capability > 7.5 kVA, typical forward voltage is 1.6 - 2.1 V, maximum leakage current at 1200V is < 500uA，and target power module size is 122mm x 62mm, including (i) design & material selections and processes. b) Numerical simulation and computer modeling for digital control and thermal management [Completion date: 24 months after project start] 4. Contract Service Deliverables for Customer (1): A technical report of a full-SiC power module design; a module packaging/assembly process report and 20 pcs engineering samples; and a power converter module with 10 pcs engineering prototypes adopting customer's SiC diodes. [Completion date: 12 months after project start] 5. Contract Service Deliverables for Customer (2) (CS-1): A technical report of a full Si-based bi-directional switch power module design; a module packaging/assembly process report and 10 pcs engineering samples. [Completion date: 12 months after the project start] 6. Contract Service Deliverables for Customer (2) (CS-2): A technical report of a hybrid SiC-based bi-directional switch power module design; a module assembly process report and 10 pcs engineering samples. [Completion date: 24 months after project start] 7. Contract Service Deliverables for Customer (3): (a) A report of SiC diode chip design, a report of SiC diode wafer fabrication process flow design, and 4 pcs 4 inch SiC diode wafer (Chip on Wafer). (b) A technical report of a full SiC-based power module design, a report of full SiC-based power module packaging/assembly process report and 5 pcs engineering samples. [Completion date: 12 months after project start]
Alpha Power Solutions Limited (Contract Service) [Sponsor]
HDK (Nan Tong) Optoelectronics Technology Co., Ltd. (Contract Service) [Sponsor]
TongFu Microelectronics Co., Ltd. (CS-1) [Sponsor]
TongFu Microelectronics Co., Ltd. (CS-2) [Sponsor]
The matrix converter is a revolutionary power electronics technology that converts an AC waveform to another AC waveform, where the output voltage and frequency can be set arbitrarily. It does away the need for a middle DC part, and reduces the ripple in the output current significantly and can send back any current generated by the load to power supply, such as when a train slows down. The key components in the matrix converter are bi-directional switches, made of silicon devices, which generate significant losses in operation. Recent advances in third-generation semiconductor SiC can eliminate this key problem, and thus unleash the superior advantages of the matrix converter. We started a seed project on SiC device design and fabrication in July 2017, and have made some inroads (e.g., the breakdown voltage reached over 1700V, passing the required 1200V by matrix converters).
This project (NSM) aims at developing a next generation matrix converter modules using SiC devices. The deliverables consist of 2 key technologies: design and fabrication of SiC devices; advanced chip and module packaging technology. The reference design of the module has a targeted performance of rated output power capability greater than 7.5kVA, SiC device with blocking voltage greater than 1200V, continuous forward current greater than 55A and optimized SiC device structure and packaging method to achieve about 20% power loss reduction, compared to the conventional bidirectional switches using Si devices. Moreover, NSM will become a power technology platform for various motor drive, wind turbine as well as railway traction applications and will speed up the growth of electric motor market.
The matrix converter module to be developed in this project can be installed in the applications where much lower harmonic distortion is required, like in hospitals, schools, office buildings, and in the lift applications with heavy repetitive loads.
The ultimate target is not only to deliver a technology platform but also to offer a tangible solution beneficial to the Greater China regional players to meet the increasing market demands and help enhance their technological competitiveness, leading to the increase of their shares in the global marketplace.