TD-LTE/TD-SCDMA 双模射频收发器芯片
ART/086CP
20100621 - 20121220
19836
张为民先生
Dual-mode Multi-band RFIC Transceiver Architecture and System Design
• Dual-mode multi-band reconfiguration design;
• MIMO design and implementation;
• Direct conversion architecture design;
• System and modules specifications definition;
• System interfaces.
Dual-mode Multi-band Transceiver Modules IP
• Modules IP design in terms of schematics, simulation and layout;
• Modules include RF front-end modules, frequency synthesizer modules, serial interface and miscellaneous modules;
• Modules IP evaluation results.
Dual-mode Transceiver RFIC chips capable of SISO, MISO and MIMO functions
• Functional RFIC engineering samples. A few silicon tapeouts are planned.
Single-mode TD-LTE Transceiver RFIC chip
• Single-mode TD-LTE RF transceiver test chip as early deliverable (13 months after project kickoff)
Demo Boards
• Demo boards for the RFIC chips to work or test in a platform.
Final Reports
• All documentations which are necessary to license our technology and IP to external partners, including design, interface and integration.
Patent Applications
• We plan to apply for one to two patents in the areas of direct conversion architecture, DC offset cancellation, MIMO, and modules design and implementation.
Industry Contribution and Sponsorship
• Guangzhou Runxin is very interested to collaborate with ASTRI, other potential customers include Nationz, Huawei, Hisilicon in Shenzhen, Rising in Guangzhou, Solomon Systech in Hong Kong, RDA in Shanghai and MTK in Taiwan, we will continue to engage with customers for IP licensing during project and after the end of project. We will review industry contribution and sponsorship status in the 9th month after project kickoff, and it is our responsibility to achieve at least 10% industry contribution within 15 months after project kickoff.
广州润芯信息技术有限公司
创毅微电子 (香港) 科技有限公司
香港中文大学
香港科技大学
LTE已被世界上大部分运营商选为它们下一步蜂窝网络演进的方向。TD-LTE作为LTE两个模式之一，不仅仅被世界上大部分运营商所选择，同时也被认为是中国3G标準TD-SCDMA的演进方向。在这个项目中，我们会开发一个双模式多频带TD-LTE/TD-SCDMA射频收发器芯片来支持中国2300至2400兆赫，2010至2025兆赫和1880至1920兆赫的频段。我们会开发有关TD-LTE/TD-SCDMA终端射频收发器的关键技术，比如，MIMO（多输入多输出），直接转换零中频架构，低噪声高线性的射频前端，可重构低通滤波器，以及小数分频的锁相环电路等等。我们计划了多次流片来开发矽验證的IP。作为这个项目的成果，我们会交付参考设计和TD-LTE/TD-SCDMA终端射频收发器的IP。这个项目将有助於香港建立技术领先的作用并帮助本地的设计公司，OEM和ODM的製造商创造竞争优势。