面板级 LED 技术平台开发
ART/122CP
20111219 - 20130618
11650
吴恩柏博士
By the end of the project, the following items will be delivered for the licensees for mass production. Detailed specifications for the functional prototypes will be described later in the report.
1. Functional prototypes of:
a. Multiple LED array for demonstration of the PL-LED platform;
b. 10 ~ 35W Single LED white light module @16V&0.8A (specifications are tabulated in Annex A) for projector applications;
c. 5W ~ 15W LED light module for general lighting application. Light module using PL-LED package (specifications are given in Table 3 of Section C) and commercial available LED packages will be integrated into LED MR16 spotlight, PAR lamp, or E27 light bulb for performance evaluation. Target specifications of different lamps are given in Table 4 of Section C.
2. Documents (soft & hard copies) for design and process guidelines:
a. Design rule of the PL-LED structure (electrical, optical, thermal, and material);
b. Evaluations of the PL-LED thermal design;
c. Flowchart and run card of the process integration;
d. Reliability characterization procedures and preliminary measurement results.
3. Report on the technology status and development strategy for ultra high power and high power-density LED chip/component/module, including IP mapping and benchmark analysis.
弗仑斯系统股份有限公司
晶元光电股份有限公司
深圳雷曼光电科技股份有限公司
深圳市上福瑞光电技术有限公司
香港理工大学
随著LED的基础及应用技术的精进，使得光效获得改善并且大幅降低成本，进而促成 LED 走出传统低亮度低功率的应用，逐渐切入显示、行动电子及照明领域。当LED为这些产业带来新的衝击及希望时，LED产业也开始思考将电子封装技术引入LED的产品应用，朝向高功率、高功率密度方向发展，以达成LED器件的高照度、高可靠度及低成本的市场趋势。 为求根本解决高功率、高功率密度等高照度应用的问题，技术团队将开发出面板级LED封装技术平台（Panel Level LED Packaging Platform, PL-LED），引入成熟之基板技术，实现可专利化LED封装架构，并以一般照明及LED投影机的光源元件验證此平台技术。相较於现阶段之LED产品可降低25%以上之热阻，并提升封装连结点之可靠度; 另一方面，结合导线重佈技术(RDL)开发出大型发光面积之LED元件。整体而言可提升10%之光输出，同时达30%之成本降低。技术团队期望藉由此平台技术及两项应用的开发，能协助香港及珠叁角地区 LED构装及照明业界之技术升级并创造更多利润。