应用於下一代叁维互连技术的新型电沉积添加剂
ART/173CP
20140301 - 20151231
9895
史训清博士
1. A report on the experimental platform for synthesis and screening of electrodeposition additives and the proposed fast-screening methodology (at least 5 times faster than existing method). 2. Design document of wafer and substrate samples with microbumps of 10-30um and microvias of 15-50um for their electrodeposition process evaluation and sample fabrication processes. 3. Formulation of at least 2 sets of 3 electrodeposition additives (accelerator, leveler and suppressor) and base plating solution, and also NMR/MS characterization data for validation of the developed additives’ formulae, GPC characterization data for validation of suppressor’s molecular weight distribution and electrochemical characterization data for validation of compositions and concentrations in the proposed base plating solution. 4. Wafer and substrate samples for electrodeposition process evaluation of microbumps of 10-30um and microvias of 15-50um, including optical & SEM photos for validation of fabricated features. 5. Performance evaluation and reliability report to substantiate the ability of the electrodeposition additives formulation to achieve surface plating thickness of 5um-10um for corresponding microvia size of 15um-50um, and dimple depth less than 3um-5um for corresponding microbump size (10um-30um) and microvia size (15um-50um) for pilot run of microbump and microvia electrodeposition.
Dr Enboa WU
Ms YH KWAN
Dr Yaofeng SUN
Dr Bin XIE
Mr Kolo TSUI
Mr Shu Kin YAU
Mr WK LUK
Ms Karina KO
Ms Fiona WANG
Dr Ziyang Gao
Mr Kwong Wa, Ken Yeung
Mr Pei Chin Ryan Chung
Dr Jun Chen
Mr Hailong, Henry Wu
Ms Lai Lai, Lily Cheng
Ms Sally XU
Mr Sunny LAO
Mr Gordon CHEUNG
Dr Paul CHAN
Dr Franky HAU
AKM Industrial Company Limited
DRPP Asia Limited [赞助机构]
Huitai Digital Technology Holdings Limited [赞助机构]
Huitai Digital Technology Holdings Limited (Technology Licensing) [赞助机构]
Shanghai Sinyang Semiconductor Materials Co., Ltd. [赞助机构]