New Electrodeposition Additives for Next-Generation 3D-Interconnect (NEA-3D)
20140301 - 20151231
Dr Xunqing Daniel Shi
1. A report on the experimental platform for synthesis and screening of electrodeposition additives and the proposed fast-screening methodology (at least 5 times faster than existing method). 2. Design document of wafer and substrate samples with microbumps of 10-30um and microvias of 15-50um for their electrodeposition process evaluation and sample fabrication processes. 3. Formulation of at least 2 sets of 3 electrodeposition additives (accelerator, leveler and suppressor) and base plating solution, and also NMR/MS characterization data for validation of the developed additives’ formulae, GPC characterization data for validation of suppressor’s molecular weight distribution and electrochemical characterization data for validation of compositions and concentrations in the proposed base plating solution. 4. Wafer and substrate samples for electrodeposition process evaluation of microbumps of 10-30um and microvias of 15-50um, including optical & SEM photos for validation of fabricated features. 5. Performance evaluation and reliability report to substantiate the ability of the electrodeposition additives formulation to achieve surface plating thickness of 5um-10um for corresponding microvia size of 15um-50um, and dimple depth less than 3um-5um for corresponding microbump size (10um-30um) and microvia size (15um-50um) for pilot run of microbump and microvia electrodeposition.
Dr Enboa WU Ms YH KWAN Dr Yaofeng SUN Dr Bin XIE Mr Kolo TSUI Mr Shu Kin YAU Mr WK LUK Ms Karina KO Ms Fiona WANG Dr Ziyang Gao Mr Kwong Wa, Ken Yeung Mr Pei Chin Ryan Chung Dr Jun Chen Mr Hailong, Henry Wu Ms Lai Lai, Lily Cheng Ms Sally XU Mr Sunny LAO Mr Gordon CHEUNG Dr Paul CHAN Dr Franky HAU
AKM Industrial Company Limited DRPP Asia Limited [Sponsor] Huitai Digital Technology Holdings Limited [Sponsor] Huitai Digital Technology Holdings Limited (Technology Licensing) [Sponsor] Shanghai Sinyang Semiconductor Materials Co., Ltd. [Sponsor]
3D interconnect for system integration offers a number of advantages, such as performance improvement and product miniaturization. Electrodeposition additives are essential for copper electrodeposition fabrication of 3D interconnects, such as microbumps on Si wafer and microvias in IC substrate. Currently these additives can only be provided by a few electronic material companies and can command very high profit margin. With the continuous miniaturization and increased functionality of today’s advanced electronics, higher technical requirements, including thinner surface deposition (down to 5um) and smaller dimple (down to 3um) are introduced for the next-generation microbump (10-20um) and microvia (15-50um) electrodeposition fabrication, hence new electrodeposition additives are needed. This project proposes new electrodeposition suppressor with narrow molecular weight distribution and new electrodeposition levelers with lower mass-to-charge ratio and balanced functional groups to meet the above-mentioned requirements for 3D interconnect fabrication. In addition, a methodology for fast screening of electrodeposition additive candidates is proposed and will be implemented to shorten the material development cycle time and reduce the development cost. At the end of this project, a platform for electrodeposition material formulation, characterization and evaluation will be built up and at least two sets of new electrodeposition additives (including one accelerator, one supressor and one leveler) will be ready for pilot production of microbumps and microvias. The development of electrodeposition additives targets the fast-growing market of next-generation microbumps/microvias fabriation, which is forecasted to be approximately US$ 6.5B by 2015 based on the Yole’s Report. This project will engage local electrodeposition equipment makers, material developers and product manufacturers to make the developed additives ready for pilot production of microbumps and microvias. This can help local relevant companies to establish core competencies in this high profit margins and high-tech market.