高功能與高密度電子構裝之低成本方案

高功能與高密度電子構裝之低成本方案

  • 高功能與高密度電子構裝之低成本方案
    ART/017CP
    20070828 - 20090630
    10798

    仲鎮華博士
    a) Technical reports for wireless-related market intelligence survey including market status & application targets. (Due date: 28/02/2008) b) Design specs and guidelines for an advanced version of the FEM module, e. g., >30% reduction in module size. (Due date: 28/02/2008) c) Design document and manufacturing process guidelines for ceramic substrate less than 150μm warpage. (Due date: 28/02/2008) d) Obtain 10% industry contribution. (Due date: 28/05/2008) e) Design documents and samples for a functional thin-film based FEM, including design for manufacturability document. (Due date: 15/12/2008) f) Microelectronics packaging-related IPs including at least 4 patents. (Due date: 2 patents, 28/04/2008; 2 patents, 23/01/2009 ) g) Establishment of a complete thin-film based FEM technology platform including substrate layout design, electrical (including the skin depth current analysis) and thermo-mechanical designs & analyses, characterization, and volume-manufacturing capabilities with preliminary reliability report. (Due date: 30/06/2009)

    在未來無線通訊模組的市場中,低成本且高功能性產品的需求日意漸增。所謂的高功能產品將會把更多的功能積體化於模組之中,例如IEEE802.11 a/b/g/n的模組, 其應用頻率將橫跨2.4GHz與5.1GHz兩個範疇。 同時對可攜式電子產品的尺寸要求, 相關模組不僅被要求縮小所佔用之基板面積, 亦須配合整體產品薄型化,而更加輕薄。這也說明了目前主流品不論是有機基板,或低溫共燒機陶瓷基板, 雖對目前產品而言仍是低成本的選擇,但其本質上的限制將造成此二類基板產品在下ㄧ世代市場需求產生進入門檻或障礙。本計劃即針對高頻之應用(有機基板之限制),提出薄型化(LTCC基板之限制)的薄膜型改質陶瓷基板,並以前端模組(FEM)作為測試載具,進行功能性, 可靠度及可量產性等驗證,以達到低成本及高功能性之市場需求。