New Electrodeposition Materials for 3D-Interconnect of High Density Substrate
Project Title:
New Electrodeposition Materials for 3D-Interconnect of High Density Substrate
Project Reference:
ARD/119
Project Type:
Seed
Project Period:
01 / 03 / 2013 - 31 / 08 / 2013
Funds Approved (HK$’000):
1950
Project Coordinator:
Dr Xunqing Daniel Shi
Deputy Project Coordinator:
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Deliverable:
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Research Group:
Dr Enboa Wu
Dr Bin XIE
Dr Yaofeng SUN
Dr Min GAO
Mr Yat Kit TSUI
Dr Dan YANG
Mr Shu Kin YAU
Mr Minghui Gao
Dr Bin XIE
Dr Yaofeng SUN
Dr Min GAO
Mr Yat Kit TSUI
Dr Dan YANG
Mr Shu Kin YAU
Mr Minghui Gao
Sponsor:
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Description:
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Co-Applicant:
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Keywords:
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