As the Hong Kong Branch of the National Engineering Research Center for Application Specific Integrated Circuit System (CNERC), ASTRI drives innovation in microelectronics and integrated circuits, developing cutting-edge ASIC solutions and advanced electronics that serve diverse industry sectors. Our expertise spans intelligent manufacturing, automotive technologies, artificial intelligence and next-generation electronics packaging. ASTRI's ASIC and Advanced Electronics portfolio includes AI-enhanced Electronic Design Automation (EDA) tools, Ultrasonic Sensor SoC chips for automotive reversing radar systems, and high-performance Neural Processing Unit (NPU) AI chips for edge computing applications.
Our advanced electronics capabilities encompass Through-Silicon Via (TSV) electroplating technology, high-power electronics packaging materials including sintered nano-metal die attach adhesives with exceptional thermal conductivity, high-Tg Electromagnetic Compatibility (EMC) materials, comprehensive thermal management solutions such as immersion coolants and thermal interface materials, and specialised nCoating materials for flexible electronics. These innovations position Hong Kong as a hub for semiconductor design and advanced electronics manufacturing, supporting the region's technological advancement and industrial competitiveness.
Research Areas & Focus
3D Integrated Chip
Power Control and Driver Chip
16 / 14 / 12nm General Purpose and Special Purpose IO Cell Libraries
The 3rd Generation Semiconductors
Ultrasonic Sensor SoC Chip for Automotive Reversing Radar
TSV Electroplating
SiC / GaN based Power and Energy Storage Technology
SiC / GaN based Power Modules
AI and IoT Chips
NPU AI Chips
Electronic Design Automation (EDA) and AI
Vision System AI Algorithms and Chips
Low-power Wireless Connection Chip
Electronics Packaging
High Power Electronics Packaging Materials
High Performance Electronics Packaging Materials
Thermal Management Materials
nCoating Materials for Flexible Devices and Electronics
