Hongkong Onmicro Electronics Limited
HongKong TongFu Technology Co., Limited (contract service)
This project is to develop system and chip for next generation capsule endoscopy to examine stomach, small intestine and large intestine. The world global market value of wireless capsule endoscopy is expected to reach $1.39 billion USD in 2026 and the estimated growth rate is 9.3% annually. In this full project, a novel asymmetrical high-speed wireless communication system will be developed for capsule endoscopy application. The fully integrated wireless capsule system-on-chip (SoC) integrates RF transceiver, modem, power management unit and protocol stack. An upgradable FPGA-based data recorder platform will also be developed to build up the whole communication system together with the capsule SoC. This project will significantly accelerate the next generation capsule endoscopy product development progress and enhance their competitiveness in the market. It will promote much wider use of capsule endoscopy thus benefits millions of patients in the world and help Hong Kong and Mainland China to hold a leading position in this field.