20071213 - 20091212
1. A complete project report including: a. Technical information b. Bench marking the performance of our inventions with current products c. Market information: i. Update potential market and market size information ii. Market characteristics and profitability 2. Two new patent applications 3. Next generation surface modification materials and associate processes with cost effectiveness and the following key attributes: a. More than 1.6 times to about 2 times heat dissipation enhancement from the surface without the coating. b. Able to pass the ASTM-D-3359 peeling test 4. Two technical transfers 5. Five prototypes applying ASTRI developed thermal management technology: a. Heat dissipation modules for12 meters tall (250W high power) LED street lamp with keeping all slug temperature below 80 degree C by applying ASHE, TIPS and ASED technologies to reduce the weight and size by 40% compare to similar product in the market. b. CPU thermal management modules capable of dissipating 31W thermal power and keeping temperature of device package surface below 80 degree C by applying TIPS and ASHE to reduce the weight and size by 30% compare to customer provided sample. c. VGA display card thermal management modules capable of dissipating highly concentrated 26W/cm2 thermal power density. The modules keep temperature of device package surface below 80 degree C by applying STES, TIPS and ASHE technologies. The customer provided sample is incapable of handling this specific thermal power density. d. Auto electronics thermal management module designed/fabricated for rear view display LED back light unit with 2500 nits, 3.5 inches in size. The operating temperature of the module is maintained below 80 degree C by applying STES, TIPS, ASED and ASHE technologies. This prototype reduces 40% of weight ans size compare to the customer provided sample. e. Heat dissipation module for high power (35W RF power)* base station. The base station casing operates with a temperature lower than 85 degree C. The weight of module is successfully reduced to two third of the customer provided base station casing (weight 30kg with 42T RF power). *Note: The RF power conversion efficiency is only 15%, in other words a base station with 45W RF output power requires 300W electrical power input and 255W will become by-product as thermal power which must be dissipated properly in order to maintain normal operation. Otherwise, either degradation in performance or damage of the base station will be resulted.
这个项目是最近完成的ITC种子项目“用於半导体元件的散热模组(HDMSD)”的延续。在这个项目中，於种子项目产生的一些创新概念将会被一一实现，主要针对四个在当今电子行业面对的散热问题，包括了：(1) 高度集中的热源，(2) 微小的空气固体热交换係数，(3) 缓慢的自然对流空气流动，(4) 在有限体积或重量下的有限散热总面积。这个项目将会为资讯科技产业带来以上四个问题的解决方案，并开发出相应的设计原型，使用以下几方面：(1) 照明，(2) 电脑中央处理器，(3) 高速显示卡，(4) 汽车用电子产品，(5) 高功率射频基站。