三維封裝的可靠性工程

三維封裝的可靠性工程

  • 三維封裝的可靠性工程
    ART/053CP
    20080923 - 20100630
    13624

    仲鎮華博士
    By the end of this full project, the following deliverables will be ready along with the samples of 3D packages: • Deliver a patentable PoP module with a warpage reduction of at least 50% and a stand-off height of 0.4mm vs. the existing PoP module using the developed virtual packaging design advisor (due by 31/12/2009); • Design documents and samples of stacked 3D system with a dimension of 12x12x3mm3 or less, including multi-functional chips (e.g., 1 digital, 1 RF, 4 memory, etc.) integrated using mixed interconnect technologies (e.g., WB, FC, TSV) (due by 30/06/2010); • Full set of validated key manufacturing process simulation models (i.e., molding, reflow, and underfill, etc.) for PoP-based 3D packages (due by 31/03/2009); • Full set of validated key manufacturing process simulation models (i.e., via drilling, via filling, and die bonding, etc.) for TSV-based 3D packages (due by 31/12/2009); • Full set of validated key reliability test simulation models (i.e., TC, humidity, preconditioning, and drop test, etc.) for PoP- and TSV-based 3D packages (due by 30/09/2009); • Demonstrate the functionalities of virtual packaging design advisor (e.g., process and reliability models, DFM and DFR guidelines, experimental techniques) for 3D packaging products/applications (due by 22/03/2010); • File at least four patents (due by 31/12/2009); • Technical reports on 3D packaging development status and trends, including worldwide 3D packaging related activities by key universities, RIs (Research Institutes) and MNCs (Multi-Nation Companies), patent mapping/strategy, market status and major applications (due by 31/03/2009).
    Akrometrix LLC [贊助機構] 華潤安盛科技有限公司 [贊助機構] Beijing Faith Information Advisory Ltd. [贊助機構] 香港科技大學 [贊助機構] First MEMS [贊助機構] Flextronics International [贊助機構] 廣東省粵晶高科股份有限公司 [贊助機構] 英特爾 [贊助機構] NXP Semiconductors Hong Kong Limited [贊助機構] 北京大學 [贊助機構] 華南理工 [贊助機構] Sin Yang [贊助機構] 中芯國際 [贊助機構] Solomon [贊助機構] WLCSP [贊助機構]

    三維封裝無疑是當前半導體工業中最先進的技術之一。為了實現電子產品的小型化和多功能﹐人們開發了三種典型的三維封裝形式: 金線鍵合(WB)﹐封裝疊層(PoP)和硅穿孔(TSV)。由於三維封裝是一個由多層材料疊合在一起而形成的複雜系統﹐在三維封裝的開發過程中﹐封裝工業界遭遇到了越來越多的可製造性和可靠性問題。基於過去十年在二維封裝中所建立的可靠性工程知識和過去幾年在三維封裝中所積累的數據﹐本項目準備開發一個虛擬三維封裝設計顧問, 它包括虛擬製造和虛擬可靠性評估兩個功能模塊及整套三維封裝可製造性和可靠性設計準則﹐並用它來解決典型的封裝疊層和硅穿孔三維封裝中相關的可製造性和可靠性問題。在此基礎上﹐本項目將進一步開發一個新的封裝疊層形式和一個新的硅穿孔三維封裝﹐並把它們應用到三維系統的集成中。本項目的成果不僅可以幫助把香港和中國的三維封裝工業水準提昇到世界前列﹐而且還可以通過新技術應用和縮短產品開發週期增強封裝工業的競爭力。