1. Establishment of experimental platform for formulation, synthesis, & performance evaluation of butterfly-mode plating (BMP) recipes. 2. Design of substrates with feature pattern including RDL trace/Cu pillar (20um-50um) and through-hole (50um-150um) and fabrication of the designed substrate samples (500 pieces). 3. Investigate the BMP process and material formulae for through-hole filling applications, including the Reverse Periodic Pulse (RPP) and Additional Differential Etching (ADE) process parameter optimization, formula design of accelerator & inhibitor, formula design of etching catalyst & stabilizer, characterization and performance evaluation of the material formulae to achieve TP>200%. 4. Investigate the RPP process and material formulae for RDL trace/Cu pillar electrodeposition applications, including process parameter optimization, leveler formula design and characterization, and performance evaluation to achieve trace/pillar surface flatness <=5% and panel-level uniformity >=90% . 5. Finalize the material recipe and process parameters with the concrete performance evaluation, reliability testing, field testing data for the fabrication of the designed substrates with RDL trace/Cu pillar of 20um-50um & through-holes with diameter of 50um-250um and thickness of 200um~500um. 6. Contract Service Deliverables for Customer 1 Design of Experiment (DOE) for the processes that are related to the interfacial voids at Cu-Filled blind vias, substrate samples fabrication, report on reliability test and analysis. 7. Contract Service Deliverables for Customer 2 -Design report on high power substrate (including RDL & Cu-pillar Bumps, power module, passive devices, heat sink, driver board and its power supply) including design, simulation and manufacturing process flow; prototype samples (5 sets of prototype samples & 5 sets of final prototype samples); performance testing report and technology transfer. -Design report on thermal sensor monitoring for high power substrate (including RDL & Cu-pillar Bumps) and 50 sets of thermal sensor prototype samples. 8. Contract Service Deliverables for Customer 3 Report on copper via filling process design and on-site evaluation of plating solution; Recipe report on copper via filling additives of accelerator, suppressor and leveler including raw materials, formulation and production process for advanced substrate application; 1000 liter via filling additive and 1000 liter flash etching additive with ASTRI’s material recipe for field tests and evaluation. 9. Contract Service Deliverables for Customer 4 Report on plating performance evaluation of screened material recipes for rigid substrate application; 1000 litre via filling additive with ASTRI's material recipe for field tests.
大功率电力电子应用中，对於先进陶瓷基板细线宽线距图形成型的需求与日俱增，尤其是对直接电镀陶瓷（DPC）的要求越来越高。与LTCC，HTCC，DBC等其他陶瓷基板类型相比，DPC基板具有更高表面平整度及更低的线路对准误差等优势。 DPC技术採用完全填充的铜通孔代替传统的银塞胶工艺，不仅降低了成本，而且在电力电子及微波领域的应用更具优势。然而，由於尺寸较小及深宽比较高等原因，DPC基板上的铜通孔无空洞完全填充及与线路一同成形难度巨大。 本项目擬开发全新的製造工艺及材料来完成DPC基板製造，並且將重点解决铜通孔无空洞完全填充的问题。同时，表面铜沉积厚度及表面平整度的问题也將得以改善以达到线路成形要求。全新的工艺是指综合优化的脉衝电镀波形、有机添加剂，搅动活化模式等三方面以达到蝴蝶型电镀填充。另外，差分蚀刻也被应用在提高蝴蝶型填充效果和表面铜沉积厚度控制中。本项目將设计全新分子结构的整平添加剂，以达到铜线路及凸点成型过程中对錶面平整度及整版均匀性的要求。