Thermal Energy Management with Advanced Materials and Structures
20071213 - 20091212
Dr Kai-yuen Lam
1. A complete project report including: a. Technical information b. Bench marking the performance of our inventions with current products c. Market information: i. Update potential market and market size information ii. Market characteristics and profitability 2. Two new patent applications 3. Next generation surface modification materials and associate processes with cost effectiveness and the following key attributes: a. More than 1.6 times to about 2 times heat dissipation enhancement from the surface without the coating. b. Able to pass the ASTM-D-3359 peeling test 4. Two technical transfers 5. Five prototypes applying ASTRI developed thermal management technology: a. Heat dissipation modules for12 meters tall (250W high power) LED street lamp with keeping all slug temperature below 80 degree C by applying ASHE, TIPS and ASED technologies to reduce the weight and size by 40% compare to similar product in the market. b. CPU thermal management modules capable of dissipating 31W thermal power and keeping temperature of device package surface below 80 degree C by applying TIPS and ASHE to reduce the weight and size by 30% compare to customer provided sample. c. VGA display card thermal management modules capable of dissipating highly concentrated 26W/cm2 thermal power density. The modules keep temperature of device package surface below 80 degree C by applying STES, TIPS and ASHE technologies. The customer provided sample is incapable of handling this specific thermal power density. d. Auto electronics thermal management module designed/fabricated for rear view display LED back light unit with 2500 nits, 3.5 inches in size. The operating temperature of the module is maintained below 80 degree C by applying STES, TIPS, ASED and ASHE technologies. This prototype reduces 40% of weight ans size compare to the customer provided sample. e. Heat dissipation module for high power (35W RF power)* base station. The base station casing operates with a temperature lower than 85 degree C. The weight of module is successfully reduced to two third of the customer provided base station casing (weight 30kg with 42T RF power). *Note: The RF power conversion efficiency is only 15%, in other words a base station with 45W RF output power requires 300W electrical power input and 255W will become by-product as thermal power which must be dissipated properly in order to maintain normal operation. Otherwise, either degradation in performance or damage of the base station will be resulted.
This full project extends the results from a recent completed (ITC supported) seed project, Heat Dissipation Module for Semiconductor Devices (HDMSD). In this full project the conceived novel concepts from the seed project will be further improved and optimized into four major fundamental solutions to deal with the problems that next generation electronic products are facing: (1) concentrated heat source, (2) small air-solid heat exchange coefficient, (3) slow air flow speed of natural convection and (4) insufficient dissipating surface area under form factor or weight restriction. These four solutions are also dealing with the requirements of ICT industry. They will be developed then integrated into workable prototypes for technology deployment into industries including: (1) lighting, (2) computer CPU, (3) VGA display card, (4) auto electronics, (5) high power base station.