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Home > Reliability Engineering for 3D Packaging

Reliability Engineering for 3D Packaging

Project TitleReliability Engineering for 3D Packaging

Project ReferenceARD/026

Project Type

Project Period20080107 - 20080707

Funds Approved (HK$’000)1924

Project CoordinatorDr Tom Chang-hwa Chung

Deputy Project Coordinator

Deliverable

Research Group

Sponsor

Description

Co-Applicant

Hong Kong Applied Science and Technology Research Institute Company Limited

5/F, Photonics Centre, 2 Science Park East Avenue, Hong Kong Science Park, Shatin, Hong Kong

Phone: (852) 3406 2800 Fax: (852) 3406 2801 Email: [email protected]

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