New Materials & Process for Next-generation High Density Interconnect Applications (NMP-HDI)

New Materials & Process for Next-generation High Density Interconnect Applications (NMP-HDI)

  • New Materials & Process for Next-generation High Density Interconnect Applications (NMP-HDI)
    ARD/146
    20150302 - 20151101
    2740

    Dr Xunqing Daniel Shi
    Dr Enboa WU Dr Yaofeng SUN Dr Bin XIE Ms Kat KWAN Dr Minghui GAO Dr Jiye LUO Dr Hailong WU Mr Shu Kin YAU Dr Sally XU Mr Haifeng FU Ms Karina KO Mr Wai Kin LUK