New Materials & Process for Next-generation High Density Interconnect Applications (NMP-HDI)

New Materials & Process for Next-generation High Density Interconnect Applications (NMP-HDI)

  • New Materials & Process for Next-generation High Density Interconnect Applications (NMP-HDI)
    ARD/146
    20150302 - 20151101
    2740

    Dr Xunqing Daniel Shi