Mixed Signal System-On-Chip (AMS SoC) Design Platform
20080316 - 20090915
Mr David Kwong
1. Complete design, tape-out and evaluation of a development platform for SoC integration. The mixed-signal SoC platform with IP Release 1 will include a digital controller core and on-chip memory and a library of high performance analog and digital IP: a) 12-bit ADC and DAC b) On-chip LDO for stable and mixed supply designs c) On-chip DC/DC converter for wide operating range (1.0v-5v) d) On-chip LVD for mission critical applications e) Built-in OP-AMP with analog comparator f) PWM, UART, GPIO, I2C, SPI 2. Specifications for future IP development for reusability.
China Resources Semiconductor Company Limited [Sponsor] Micom Tech Limited [Sponsor] MiniLogic Device Corporation Ltd [Sponsor] Pericom Technology Inc [Sponsor] Simmons Electronic Products Ltd [Sponsor] Union Semiconductor (HK) Limited [Sponsor]
The electronics industry is increasingly focused on the consumer marketplace, which requires low-cost high-volume products to be developed very rapidly. This, combined with advances in deep submicron technology has resulted in the ability and the need to put entire system on a single chip. As more of the system is included on a single chip, the most likely the chip will be mixed-signal because most systems include at least some analog or mixed-signal at the interfaces. Because of the growing demand for mixed-signal SoC applications and the complexity and size of circuits in a system, more companies are taking advantage of design out-sourcing to get access to all of the specialized knowledge needed to produce a competitive system in silicon. This project aims to provide local design houses a mixed-signal development platform with high performance analog IP library which enables them to improve performance, reliability, and compete in the world market.