Advanced Wireless Super-Physical Layer for Wireless Personal Area Networking Core Technology Platform

Advanced Wireless Super-Physical Layer for Wireless Personal Area Networking Core Technology Platform

  • Advanced Wireless Super-Physical Layer for Wireless Personal Area Networking Core Technology Platform
    ART/024CP
    20071115 - 20090515
    13876

    Mr Peter Diu
    The project deliverables are conceived and planned to meet customers’ technology development and product design requirements. These deliverables are grouped in four licensable packages: (1) CMOS UWB RFIC design package - ASIC CMOS RFIC for UWB, Mode 1 Frequency Range in the circuit format - ASIC circuit topology in schematic tool format - Mask layout in GDS II format - Verification models, input test wave forms, and test outputs - CMOS RFIC specifications and data sheet (2) RFIC CMOS reusable modeling IP blocks for SMIC 0.18um CMOS technology Package - Test bed circuits in circuit topology format - Test bed passive and active components in the GDS II layout format - Test results documentation in the text format - Design documents including data sheet, system designer’s guide, and application notes (3) RFIC CMOS reusable IP blocks package - Broadband LNA circuit - RF switch - Image reject quad RF mixer - 4th order Chebyshev gm-C filter - High speed PLL - Temp-insensitive bias supply circuit - High speed SSB mixer circuit - Circuit topology in tool format - Circuit simulation I/O decks in tool format (4) Testing technical documentation and measured data for CMOS IP blocks package; - Circuit design documents - PCB design documentations - Required components information - Measured data and test methodology documentation In addition to the above licensable package deliverables, the project will include the filing of innovative circuit design patents, it is expected that 3 patents will be filed. The project will also include the design and construction of a reference design board for testing purposes.
    Alereon Inc. ARM Ltd. Automatic Mfg. Ltd. Chung Nam Electronics Company Limited IGRS (Intelligent Grouping & Resource Sharing) OFTA (Office of the Telecommunications Authority) SMIC (Semiconductor Manufacturing International (Shanghai) Corp) [Sponsor] The Chinese University of Hong Kong The Hong Kong University of Science and Technology

    The rapid adoption of digital media products and the growing use of multimedia content in home CE (consumer electronics) environment are generating the demands for interconnecting PC and CE devices wirelessly in a personal networking setting. Wireless USB (Universal Serial Bus) standards, based on UWB (Ultra-Wide Band) radio technologies, have been applied to address PC-based applications, market demands exist for standard-based solutions applicable for digital home wireless applications involving intelligent CE centric (non-PC) products and devices as well. This research project focuses on the creation and the innovative design of a UWB RF transceiver based on superheterodyne principle requiring only a single resonant network and a single phase-locked loop, employing standard CMOS technology. The research efforts will generate a CMOS RF design methodology; produce RF IP blocks and an RFIC (Radio Frequency Integrated Circuit). The resultant technologies and advanced design solution will support both WPAN (Wireless Personal Area Networking) stand-alone systems and embedded applications, enabling low power and cost effective solutions to be developed for UWB applications, allowing local electronic manufacturers to create new high speed wireless multimedia consumer devices and products.