Project Intern, Simulation & Programming

Job Description


Job Responsibilities

  • Assist in ITF R&D project as assigned:
    • To support electronics materials and process development for 3D-IC fabrication and packaging applications
    • To carry out mechanical structure design and simulation to the development of in-house experimental setups
    • To conduct application programming to facilitate in-house material development process


  • Graduate with a first-degree or higher degree in Mechanics/Mechanical Engineering, Electrical/Electronic Engineering, Computer Science/Engineering or related disciplines, including non-local students, from a local university in Hong Kong.
  • Successfully completed the undergraduate/postgraduate program
  • Good knowledge in computer aided engineering and/or computer programming
  • Hand-on experience in application programming and/or mechanical simulation is a plus
  • Good communication skills in English & Mandarin


To apply, please email [email protected] with your resume, you must quote the Job Ref and include the following information:
  1. Name of University
  2. Degree obtained/expecting and when
  3. Have you participated in ITF Project Internship Program before? Yes/No
  4. If you answer Yes in item 3, please state the period
  5. Have you been employed by ASTRI before? If yes, please state the period
  6. Academic referee
  7. Your R&D skills
  8. Your work experience, if applicable
Application Deadline: 6 May 2016