Job Description
2016/ART204/NMP-HDI-F/PI/1
Job Responsibilities
- Assist in ITF R&D project as assigned:
- To support electronics materials and process development for 3D-IC fabrication and packaging applications
- To carry out mechanical structure design and simulation to the development of in-house experimental setups
- To conduct application programming to facilitate in-house material development process
Requirements
- Graduate with a first-degree or higher degree in Mechanics/Mechanical Engineering, Electrical/Electronic Engineering, Computer Science/Engineering or related disciplines, including non-local students, from a local university in Hong Kong.
- Successfully completed the undergraduate/postgraduate program
- Good knowledge in computer aided engineering and/or computer programming
- Hand-on experience in application programming and/or mechanical simulation is a plus
- Good communication skills in English & Mandarin
Application
To apply, please email [email protected] with your resume, you must quote the Job Ref and include the following information:
- Name of University
- Degree obtained/expecting and when
- Have you participated in ITF Project Internship Program before? Yes/No
- If you answer Yes in item 3, please state the period
- Have you been employed by ASTRI before? If yes, please state the period
- Academic referee
- Your R&D skills
- Your work experience, if applicable