Engineering Associate (PI) / Engineer (PI), Module Design

Job Description


Job Responsibilities

  • Assist in ITF R&D project as assigned;
  • Self-sufficient to develop package/module/sub-system/system level integration solutions for power electronics applications;
  • To undertake process development, testing and failure analysis for power packages/modules/sub-systems/systems;
  • To evaluate the system integrity and reliability of power electronics products according to difference application scenarios;


  • Master or higher degree in material science, physics, mechanical engineering, chemical engineering or other related disciplines, including non-local applicant;
  • Experience on electronic packaging & module integration is a must;
  • Experience on ceramic-related materials, fabrication process, testing and failure analysis is a big plus;
  • Fluent in English, good written and oral communications skills;
  • Strong team spirit and interpersonal skills;
  • Independent, responsible, aggressive and outgoing character


To apply, please email [email protected] with your resume, you must quote the Job Ref and include the following information:

  1. Name of the University
  2. Degree obtained/expecting and when
  3. Have you participated in the ITF Project Internship Program before? Yes/No
  4. If you answer Yes in item 3, please state the period
  5. Have you been employed by ASTRI before? If yes, please state the period
  6. Academic referee
  7. Your R&D skills
  8. Your work experience, if applicable

Application Deadline: until this position is filled. Only short-listed candidates will be notified.

ASTRI is an Equal Opportunities Employer. Personal data provided by applicants will be used for consideration of an application only.  ASTRI reserves the right not to fill the position.