Engineer (PI) / Engineering Associate (PI), Process Development

Job Description


Job Responsibilities

  • Assist in ITF R&D project as assigned.
  • To support electronics interconnect materials and process development for 3D-IC fabrication and packaging applications.
  • To carry out material characterization and performance evaluation experiments for electronic interconnect material development.
  • To conduct material characterization data analysis and write the experimental report.


  • Graduate with a Bachelor or Master’s degree in  Material Science/Engineering, Electrical and Electronic Engineering, Information Engineering or relevant disciplines, including non-local graduates from a local university in Hong Kong.
  • Successfully completed the undergraduate/postgraduate program.
  • Good knowledge in design of experiment and experimental data analysis.
  • Hand-on experience in instrument operation for material characterization and performance evaluation is a plus.
  • Good communication skills in English & Mandarin.


To apply, please email [email protected] with your resume, you must quote the Job Ref and include the following information:

  1. Name of University
  2. Degree obtained/expecting and when
  3. Have you participated in ITF Project Internship Program before? Yes/No
  4. If you answer Yes in item 3, please state the period
  5. Have you been employed by ASTRI before? If yes, please state the period
  6. Academic referee
  7. Your R&D skills
  8. Your work experience, if applicable

Application Deadline: until this position is filled. Only short-listed candidates will be notified.

ASTRI is an Equal Opportunities Employer.  Personal data provided by applicants will be used for consideration of an application only.  ASTRI reserves the right not to fill the position.