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ASTRI has established an Advanced Packaging Technologies Consortium (APTC) since 2006 with an objective of promoting the advancement of microelectronics packaging technology in the industry.

• APTC provides updated market analyses, product intelligence and applications of advanced packaging technologies such as reverse engineering on the latest products for its members. 
• It introduces leading-edge microelectronics packaging technologies to its members. 
• It also provides a networking platform for the whole supply chain of microelectronics packaging industry. 

As at March 2012, APTC has 44 members, including foundries, packaging subcontractors, materials & equipment manufacturers, IDMs, design houses, testing services, and universities, etc.

Please visit www.hkaptc.org for more details.

If you are interested in joining APTC or would like to make an enquiry, you are welcome to contact Ms Tina Yang (Email: tinayang@astri.org, Tel: 852-34062555; 86-755-8632 9394).