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Material & Packaging Technologies Group

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The Material & Packaging Technologies (MPT) Group specializes in developing high value, next generation technologies and products comprising devices, components, modules and systems that are differentiated mainly by material and packaging technologies. To meet the increasing needs of industries in Hong Kong and the Mainland, MPT focuses on the following three technology areas: LED, Packaging & Sensing, and Green Energy.

Since establishment in 2005, the MPT Group has made remarkable achievements in terms of creation of intellectual properties and technology commercialization. By January 2013, a total of 182 invention patents have been granted from the US, China and Taiwan and of these 85 came from the US. These innovations have proved to be very useful to industries in Hong Kong and the Chinese mainland with 109 companies adopting MPT’s technologies through 182 technology transfers, including 1 successful spin-off in 2010. The MPT Group has won 23 technology awards from the Mainland, Hong Kong, US, Japan and Korea.
 
Key Technologies and Products of Material & Packaging Technologies Group

Key Technologies and Products of Material & Packaging Technologies Group (Jan 2013)
         
 

Key technologies and products of MPT group

LED Technologies
  • Ultra High Power LED Chip
  • LED Packaging Solution
    • Panel level LED packaging
    • LED phosphor printing
  • LED Solution for Indoor Lighting
    • Birdcage solution – MR16 / PAR38
    • Omnidirectional light bulb
  • LED Solution for Streetlamps & Corridor Lamps
  • Sensor-based Wireless Lighting Control System
  • Display System
    • Intelligent digital signage display
    • Touch and multi-touch solution
    • Pico projector modules
Packaging & Sensing
  • Optical Zoom, Anti-shaking and Compact Camera Modules
  • Healthcare Electronics
    • Smart pulse oximetry measurement module and dongle solution
    • Cuffless blood pressure measurement module
  • MEMS Thermal Inkjet Printhead & Printing Applications
  • Tyre Pressure Monitoring System (TPMS) for Automotives
  • Advanced 3D Packaging Solutions
    • 3D wafer level package solution for CMOS image sensor applications
    • Through-Silicon-Via (TSV) manufacturing process modeling & simulation software
    • 3D System-in-Packaging (SiP) solutions for high frequency and high power electronics products
Green Energy
  • High Capacity Anode Materials for Lithium-ion Batteries
  • Concentrating Photovoltaic Module