Packaging and Sensing
MPT’s packaging and sensing technologies consist of the development of advanced System in-Package (SiP) and 3D-packaging technologies, advanced compact camera modules and camera fl ash, healthcare electronics and printed electronics.
MPT utilizes advanced packaging technologies for device, module and system integration to support the strong electronics and opto-electronics industries in Hong Kong and the Mainland. MPT also develops sensing technologies for next generation CMOS image sensors, Tyre Pressure Monitoring System (TPMS) and portable vital sign monitoring devices.
By 2010, 53 US patents have been fi led, 56 technology transfers have been made to 34 companies in Hong Kong, the Mainland and rest of the world. MPT has established an Advanced Packaging Technologies Consortium
with 39 company members since 2006. The consortium has successfully encouraged interactions between industries, universities and research institutes.