Corporate image photo: Advanced Packaging Technologies Consortium organizes workshop for exchanging market intelligence
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Advanced Packaging Technologies Consortium organizes workshop for exchanging market intelligence

More than 50 practitioners attended a workshop organized by ASTRI’s Advanced Packaging Technologies Consortium to exchange the latest market intelligence of the field at Holiday Inn, Pudong, Shanghai on 18 May 2010.
 
Entitled “Updates of Advanced Packaging Technologies”, the workshop began with an opening remark by Dr Tom Chung, Vice President and R&D Director of MPT Group. Dr Reynold Wang, Senior Engineer; Dr Daniel Shi, Manager and Dr Jerro Lin, Manager; delivered presentations respectively. Other guest speakers included Dr Herb Huang, Director of Specialty Technology Development, Semiconductor Manufacturing International ( Shanghai) Corp. and Prof. Ricky Lee, Professor of Mechanical Engineering at the Hong Kong University of Science and Technology. A panel discussion session followed.
 
The Consortium regularly organises workshops to provide participants with the latest market trends as well as updates of development in advanced packaging technologies, including System-in-Package (SiP), Radio-frequency (RF) SiP packaging, Through-silicon-via (TSV) and LED packaging. It also offers an invaluable platform for practitioners to exchange experiences, find solutions and business opportunities in advanced packaging technologies.
 
More than 50 practitioners from PRC and Hong Kong participate in the workshop.
 
Dr Daniel Shi, Director of MPT Group, delivers a presentation entitled “Development of CMOS-Compatible Process for TSV-related Applications“.
 
Dr Herb Huang, Director of Specialty Technology Development, Semiconductor Manufacturing International (Shanghai) Corp., gives a talk on “Will SiP Roadmap be practical for today’s market “.
 
Prof. Ricky Lee, Professor of Mechanical Engineering at the Hong Kong University of Science and Technology, delivers a presentation on “Advanced Packaging of High-Brightness LEDs for Solid State Lighting”.
 
Dr Tom Chung (first from left), Prof. Ricky Lee (first from right) and Mr Atsushi Okuno (second from right) answering questions raised in the panel discussion.
 
Participants discuss actively during the meeting.