Devices and Packaging
   
  Light Emitting Diode (LED) Technology
   
 
ASTRI researchers are developing an effective technology platform for light emitting diodes (LEDs) with substantially increased brightness and enhanced uniformity, including device design and process, packaging design and process, material development, and optics and thermal design. Prototypes that integrate these technologies are under development for LCD backlighting, LED general lighting, LED point source lighting, and automotive lamps applications.
 
LED Components / Modules

Device Design and Process

~ ITO and NiAu
~ Photonic crystal technologies
~ Thermal dissipation and ESD
~ Current spreading optimization
~ Thin film LEDs

Packaging and Modules

~ High failure and defect tolerable LEDs
~ Low energy consumption LEDs
~ 3-in-1 and 4-in-1 LED packaging
~ Chip-on-board LED packaging
~ Thermal, optical and electrical designs

LED Systems

~ LED driving mechanism design
~ AC-LED systems
~ Air-solid heat exchange (A-SHE) technology
~ Smart product design and prototyping
 

Material & Packaging Technologies
Devices and Packaging
   
   
   
   
   
   
   
   
   
   
   
Advanced Packaging Technologies
   
   
   
Photonic Components
   
Light Emitting Diode (LED) Technology
ASTRI's LED Device Achievement and Plan
LED for General Lighting
LED Applications in Display Field
Device Materials
Surface Modification for Heat Dissipation
Energy Storage Devices
Material for Electrical Write-once-memory
   
Advanced Packaging Technology
Advanced Packaging Design Center of Excellence (APDCoE)
Features of SiP Developed by ASTRI APDCoE
   
Smart Optical Sensors
VCSEL Transmitter
MSM Photodetectors
Optoelectronic Interface Circuit (OEIC)
Red/ Green/ Blue LED Transmitters
Optical Reflective Sensor