Advanced Packaging Technology

   
  Features of SiP Developed by ASTRI APDCoE
   
 
~ Significant module size reduction

~ Outstanding transceiving performance

~ Lower cost solution

~ Simplified product system board design and assembly

~ Shorten time-to-market to capture the emerging market with high growth rate

 
APDCoE is looking for partners to commercialize the innovative SiP technologies developed by ASTRI for enabling the smaller form-factor, lower-cost and shorter time-to-market solutions for their products.