Advanced Packaging Technology
   
  Advanced Packaging Design Center of Excellence (APDCoE)
   
 
ASTRI provides cost-effective and reliable product-oriented advanced packaging licensable technologies and services for full system or sub-system integration. The strengths of the center include:
 
~ Over 75% of staffs hold Master & PhD degrees.

~ Dedicated group focusing on advanced packaging design, analysis and characterization.

~ Over 1 million USD investment on facilities.

~ Typically less than 5 months in implementing a SiP.
~ Previous design help customer to win the CES award (CES 2006).
 
Applications
~ Wireless Products
~ Consumer Electronics
~ Automotive Electronics
~ Medical Electronics
~ Optical Electronics
~ Wearable Electronics

Material & Packaging Technologies
Devices and Packaging
   
   
   
   
   
   
   
   
   
   
   
Advanced Packaging Technologies
   
   
   
Photonic Components
   
Light Emitting Diode (LED) Technology
ASTRI's LED Device Achievement and Plan
LED for General Lighting
LED Applications in Display Field
Device Materials
Surface Modification for Heat Dissipation
Energy Storage Devices
Material for Electrical Write-once-memory
   
Advanced Packaging Technology
Advanced Packaging Design Center of Excellence (APDCoE)
Features of SiP Developed by ASTRI APDCoE
   
Smart Optical Sensors
VCSEL Transmitter
MSM Photodetectors
Optoelectronic Interface Circuit (OEIC)
Red/ Green/ Blue LED Transmitters
Optical Reflective Sensor