Advanced Packaging
Team at ASTRI has been developing cost-effective, reliable
and licensable technologies and services for full system or
sub-system integration that are available to the electronics
industries in Hong Kong and the Greater China. Advantages
of advanced packaging like System-in-Package include reduced
module size, improved electrical performance, increased functionality
per unit area/volume, lower-cost solution and, more importantly,
shorter time-to-market. At ASTRI, we possess state-of-the-art
advanced package design, modeling tools, technical expertise
on packaging design, analysis and characterization which can
effectively reduce the form factor and time-to-market of the
existing products produced by our partners. We have also established
close relationship with tier-1 semiconductor assembly and
testing (SAT) sub-contractors to help our partners in the
mass production of their products.
The application of advanced packaging technology is tremendously
wide, and particularly ideal for form-factor demanding portable
electronics devices such as cellular phones, medical implants,
automotives, wearable electronics, etc.
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