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材料與構裝技術 |
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先進封裝項目 |
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已申請國際專利7項(只供英文名稱) (2005-2007) |
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- Multi-chip package with bottom-mounted RF die and built-in EMI shielding.
- Thermally enhanced BGA/LGA structure with internal heat spreader and the substrate design method.
- Innovative EMI Shield Solution for Advanced Packaging.
- LED light source packaging using chip-on-board structure (jointly with LED program).
- Novel light source for LCD backlight unit using chip-on-board structure.
- Multi layer lighting source with embedded RF control and integrated antenna.
- Radio Frequency Front-End Module Using Thin Film Passive on Ceramics.
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